E&R Engineering Debuts Advanced Solutions at Semicon SEA 2024

 

E&R Engineering Corp., the leading provider of advanced laser and plasma solutions from Taiwan, will be attending Semicon SEA 2024, the feast in the Semiconductor industry, held in Kuala Lumpur, Malaysia. With their 30 years of experience in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. They will be showcasing their latest solutions at the event, which include:


1. Plasma Dicing - E&R offers a unique hybrid solution that combines laser grooving and plasma dicing. This allows for precise control of dice lanes ranging from 10um to 30um. In addition to equipment manufacturing, E&R also provides a convenient one-stop-shop dicing service to process wafers into small dies of various shapes, such as hexagonal, circular, or MPR pattern.


2. Advanced Packaging - E&R specializes in integrating self-developed optics modules and advanced laser systems to provide a laser drilling solution for 2.5D/3D packaging. Their solution offers high accuracy up to +/- 5um, with a remarkable B/T ratio of 85~90%. E&R is also well-known for their precision laser marking, which features a 4 beam marking solution for high throughput while maintaining an accuracy of +/- 25um. They excel in heat affect control for laser cutting processes and offer high uniformity plasma solutions with a CPK value exceeding 1.33.


More Information : https://www.techdogs.com/tech-news/pr-newswire/er-engineering-corp-unveils-cutting-edge-solutions-at-semicon-sea-2024-in-kuala-lumpur

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