SK Hynix Joins TSMC to Boost HBM Leadership

 


SK hynix Inc. has recently entered into a memorandum of understanding with TSMC to collaborate on the production of next-generation HBM and enhance logic and HBM integration through advanced packaging technology. This partnership aims to develop HBM4, the sixth generation of the HBM family, which is scheduled to be mass produced from 2026.


By joining forces with TSMC, a leading global logic foundry, SK hynix, a global leader in the AI memory space, anticipates significant advancements in HBM technology. This collaboration is expected to drive breakthroughs in memory performance through a trilateral partnership involving product design, foundry capabilities, and memory provision.


The initial focus of this collaboration will be on enhancing the performance of the base die, which is situated at the bottom of the HBM package. HBM is created by stacking a core DRAM die on top of a base die that incorporates TSV technology. The layers in the DRAM stack are vertically connected to the core die using TSV, resulting in an HBM package. The base die, located at the bottom, is connected to the GPU, which controls the HBM.


More Information : https://www.techdogs.com/tech-news/pr-newswire/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership

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